Zeolite-Reinforced Interpenetrating Polymer Network Initiated by Chalcone Based Photoinitiating System and Their Application in 3D/4D Printing

April 18, 2022

Title

Zeolite-Reinforced Interpenetrating Polymer Network Initiated by Chalcone Based Photoinitiating System and Their Application in 3D/4D Printing

Author

Yijun Zhang, Hong Chen, Loïc Vidal, Gautier Schrodj, Fabrice Morlet-Savary, Frédéric Dumur, Angélique Simon-Masseron, Jacques Lalevée

Year

2022

Journal

ADVANCED MATERIALS TECHNOLOGIES

Abstract

With the rapid development of photopolymerization, the search for new near-UV/visible light sensitive photoinitiating system (PIS) is one of the most interesting topics in polymerization area. In this work, a new PIS (chalcone dye/amine/iodonium salt) could efficiently and simultaneously initiate the free radical photopolymerization of polyethylene glycol diacrylate (PEGDA) and the cationic photopolymerization (CP) of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (EPOX) upon LED@405 nm irradiation to obtain interpenetrating polymer network (IPN). Furthermore, this PIS was employed in the photopolymerization of LTA-5A zeolite filled interpenetrating polymer network composites (IPN, PEGDA/EPOX). Compared to the pure IPN, the depth of cure (DOC) for IPN with 50 wt% LTA-5A remarkably increased by ca. 90%, which was the first time reported that DOC could increase with the increase of the filler content. 3D patterns with good resolution were manufactured through direct laser write technique, and those with high filler contents showed good water swelling property. Under hydrothermal stimuli, IPN composite with 50 wt% LTA-5A exhibited a good 4D printing behavior. Therefore, not only this chalcone dye has a good photoinitiation ability for photopolymerization, but also the resulting IPN composites prepared with the photoinitiating system containing this dye have potential applications for 3D/4D printing and composites preparation.

Instrument

V-730/ FP-6500/ FT/IR-4700

Keywords

photoinitiating system, PIS, 3D,4D,printing