Film Thickness Specifications

UTS-2000 Film Thickness Measurement System – Specfications

Measurement MethodFTIR interference method for film thickness measurements
Measurement ConfigurationReflection, Transmission (option)
ObjectivesNear infrared: Lens objectives (4x) and Cassegrain objectives
(15x, 30x)
Mid-infrared: Cassegrain objectives (15x, 30x)
Focus Mechanism11mm stroke
Sampling Area20 x 20 µm to 1200 x 1200 µm
Sample PositioningVerification of measurement area using an integrated CCD camera
Film Thickness0.25 to 750 µm (for Si)
Reproducibility±0.005 µm or less (for Si with identical measurements)
XY Stage Stage Movement Range200 x 200 mm Standard (Other options available)
XY Stage Minimum Step Size2 µm
Operating SystemWindows 7 Professional
UPS (Uninterruptible Power Supply)Maintains PC and display power for 15 minutes after a power failure
System ControlSpectra Manager Suite; Optics and X-Y stage control;

Wafer cassette system control (option)
TableIntegrated vibration isolation table
Dimension and weight1240(W) x 862 (D) x 1763 (H) mm, Approx. 300 kg (excluding protrusions or optional cassette loading system)
Power Requirement300 VA


AYT-4000 Film Thickness Measurement System – Specifications

InstrumentFT/IR-4000 or FT/IR-6000 (not vacuum type)
Measurement ModeTransmission and Reflection (Center of incident angle: 15°)
Measurement optionsSingle-point, Lattice Mapping, Radial Mapping
Spot SizeAdjustable by aperture
Moveable RangeY: 0-168mm, theta: 180-180°
AccuracyY: +/- 0.5mm, theta: +/- 0.19°
CommunicationUSB 2.0
Dimension and Weight (H) 408mm, (W) 377mm, (D) 433mm, 14 Kg